Mechanical Engineering Technical Leader || Creo, UG NX || Electronics Packaging || Chassi Design || Enclosure Design || Exp - 12+ years

Cisco · Bengaluru · Posted 2026-07-09

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About the role

We are part of the Hardware Platform Group, with our team specializing in FPGA development. Our work spans both sophisticated data-path and challenging control-path FPGAs. The design process includes crafting the FPGA functional specification document, RTL coding, image generation and validation. We leverage industry-standard tools for FPGA design, incorporating various quality metrics to ensure a robust process. Our ultimate goal is to deliver bug-free RTL for first-pass success on the board. Additionally, we collaborate closely with our remote teams based in US and Italy.
Responsibilities:
- * Design and development of next generation Telecom & Datacentre products
- * Participate in the architecture definition, implementation and verification phases.
- * Work closely with ASIC team during initial characterisation and define system level integration based on acquired input.
- * Develop and implement process and design improvement guidelines and ensure they are relevant to the latest Design methodology.
- * Work with multi-functional teams (hardware, software, diagnostics and signal integrity groups).
- * Assist in complex subsystem level lab bring-up, integration, and unit test validation.
- * Mentor team and formulate processes that allow team to grow and upskill.
- * Have strong documentation and data management skills to ensure lessons learnt and accessible to the wider team
- * Hands-on examples of using Ai tools for automation and faster data retrieval
Qualifications:
- *Educational Background: Requires 12+aa years of hands-on experience in design of Telecom & Datacentre products with MTech/BTech in Mechanical Engineering
- * Experienced in solid modelling Tools such as Creo and UG-NX
- * Hands on experience with Structural Simulation tools like Ansys
- * Working examples of mentoring and leading a Technical team, experience as a people manager would be an advantage
- * Good knowledge of System Thermal and current cooling methodologies and limitations of each kind.
- * Knowledge on mechanical reliability tests and Material selection to cater to corrosive environments
- * Good English written and verbal communications. Self-motivation, partnership and strong interpersonal skills are needed.

Qualifications

- Educational Background: Requires 12+aa years of hands-on experience in design of Telecom & Datacentre products with MTech/BTech in Mechanical Engineering
- Experienced in solid modelling Tools such as Creo and UG-NX
- Hands on experience with Structural Simulation tools like Ansys
- Working examples of mentoring and leading a Technical team, experience as a people manager would be an advantage
- Good knowledge of System Thermal and current cooling methodologies and limitations of each kind.
- Knowledge on mechanical reliability tests and Material selection to cater to corrosive environments
- Good English written and verbal communications.
- Self-motivation, partnership and strong interpersonal skills are needed.

Responsibilities

- Design and development of next generation Telecom & Datacentre products
- Participate in the architecture definition, implementation and verification phases.
- Work closely with ASIC team during initial characterisation and define system level integration based on acquired input.
- Develop and implement process and design improvement guidelines and ensure they are relevant to the latest Design methodology.
- Work with multi-functional teams (hardware, software, diagnostics and signal integrity groups).
- Assist in complex subsystem level lab bring-up, integration, and unit test validation.
- Mentor team and formulate processes that allow team to grow and upskill.
- Have strong documentation and data management skills to ensure lessons learnt and accessible to the wider team
- Hands-on examples of using Ai tools for automation and faster data retrieval

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